advanced power p-channel enhancement mode electronics corp. power mosfet low on resistance bv dss -20v capable of 2.5v drive r ds(on) 20m fast switching i d -9.5a rohs compliant description absolute maximum ratings symbol units v ds v v gs v i d @t a =25 a i d @t a =70 a i dm a p d @t a =25 w w/ t stg t j symbol value unit rthj-amb maximum thermal resistance, junction-ambient 3 50 /w data and specifications subject to change without notice 200805061 1 AP9620GM-HF rating -20 8 -9.5 parameter drain-source voltage gate-source voltage continuous drain current 3 0.02 storage temperature range continuous drain current 3 -7.6 pulsed drain current 1 -76 halogen-free product thermal data parameter total power dissipation 2.5 -55 to 150 operating junction temperature range -55 to 150 linear derating factor advanced power mosfets from apec provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. the so-8 package is widely preferred for all commercial-industrial surface mount applications and suited for low voltage applications such as dc/dc converters. s s s g d d d d so-8 g d s
electrical characteristics@t j =25 o c(unless otherwise specified) symbol parameter test conditions min. typ. max. units bv dss drain-source breakdown voltage v gs =0v, i d =-250ua -20 - - v r ds(on) static drain-source on-resistance 2 v gs =-4.5v, i d =-9.5a - - 20 m v gs =-2.5v, i d =-6.0a - - 35 m v gs(th) gate threshold voltage v ds =v gs , i d =-250ua - - -1 v g fs forward transconductance v ds =-10v, i d =-9.5a - 28 - s i dss drain-source leakage current v ds =-20v, v gs =0v - - -1 ua drain-source leakage current (t j =70 o c) v ds =-16v, v gs =0v - - -25 ua i gss gate-source leakage v gs =-- na q g total gate charge 2 i d =-9.5a - 30 - nc q gs gate-source charge v ds =-10v - 6 - nc q gd gate-drain ("miller") charge v gs =-5v - 3.5 - nc t d(on) turn-on delay time 2 v ds =-10v - 26 - ns t r rise time i d =-9.5a - 500 - ns t d(off) turn-off delay time r g =6 ? v gs =-4.5v - 70 - ns t f fall time r d =1.05 - 300 - ns c iss input capacitance v gs =0v - 2158 - pf c oss output capacitance v ds =-15v - 845 - pf c rss reverse transfer capacitance f=1.0mhz - 230 - pf source-drain diode symbol parameter test conditions min. typ. max. units i s continuous source current ( body diode ) v d =v g =0v , v s =-1.2v - - -2.08 a v sd forward on voltage 2 t j =25 : , i s =-2.5a, v gs =0v - - -1.2 v notes: 1.pulse width limited by max. junction temperature. 2.pulse test 3.surface mounted on 1 in 2 copper pad of fr4 board ; 125 : /w when mounted on min. copper pad. this product is sensitive to electrostatic discharge, please handle with caution. use of this product as a critical component in life support or other similar systems is not authorized. apec does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. apec reserves the right to make changes without further notice to any products herein to improve reliability, function or design. 2 AP9620GM-HF 8v 100
AP9620GM-HF fig 1. typical output characteristics fig 2. typical output characteristics fig 3. on-resistance v.s. gate voltage fig 4. normalized on-resistance v.s. junction temperature 3 0 30 60 90 120 0246 -v ds , drain-to-source voltage (v) -i d , drain current (a) t a =25 o c -10v -8.0v -6.0v v gs =-4.0v 15 20 25 30 35 40 123456 -v gs (v) r ds(on) (m ) i d =-9.5a t a =25 : 0 20 40 60 80 100 02468 -v ds , drain-to-source voltage (v) -i d , drain current (a) t a =150 o c -10v -8.0v -6.0v v gs =-4.0v 0.6 0.8 1.0 1.2 1.4 1.6 -50 0 50 100 150 t j , junction temperature ( o c) normalized r ds(on) i d =-9.5a v gs =4.5v
AP9620GM-HF fig 5. maximum drain current v.s. fig 6. typical power dissipation case temperature fig 7. maximum safe operating area fig 8. effective transient thermal impedance 4 0 0.5 1 1.5 2 2.5 3 0 30 60 90 120 150 t c , case temperature ( o c) p d (w) 0.001 0.01 0.1 1 0.0001 0.001 0.01 0.1 1 10 100 1000 t , pulse width (s) normalized thermal response (r thja ) p dm duty factor = t/t peak t j = p dm x r thja + t a r thja =125 o c/w t t 0.02 0.01 0.05 0.1 0.2 duty factor = 0.5 single pulse 0 2 4 6 8 10 25 50 75 100 125 150 t c , case temperature ( o c) -i d , drain current (a) 0.01 0.1 1 10 100 1000 0.1 1 10 100 -v ds (v) -i d (a) t a =25 o c single pulse 100us 1ms 10ms 100ms 1s 10s d c
AP9620GM-HF fig 9. gate charge characteristics fig 10. typical capacitance characteristics fig 11. forward characteristic of fig 12. gate threshold voltage v.s. reverse diode junction temperature 5 0.01 0.10 1.00 10.00 100.00 0.1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 -v sd (v) -i s (a) t j =25 o c t j =150 o c 100 1000 10000 1 5 9 13 17 21 25 29 -v ds (v) c (pf) f =1.0mhz ciss coss crss 0 0.2 0.4 0.6 0.8 1 -50 0 50 100 150 t j , junction temperature ( o c) -v gs(th) (v) 0 1 2 3 4 5 6 7 0 5 10 15 20 25 30 35 40 q g , total gate charge (nc) -v gs , gate to source voltage (v) i d =-9.5a v ds =-10v
AP9620GM-HF fig 13. switching time circuit fig 14. switching time waveform fig 15. gate charge circuit fig 16. gate charge waveform 6 t d(on) t r t d(off) t f v ds v gs 10% 90% q v g -4.5v q gs q gd q g charge 0.5 x rated v ds to the oscilloscope -5v d g s v ds v gs r g r d 0.5 x rated v ds to the oscilloscope d g s v ds v gs i d i g -1~-3ma
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